Panel on Semiconductors
Thu, Nov 30
|Hopkins Bloomberg Center
The panel examined semiconductor innovation, geopolitics, and sustainability, addressing AI integration, supply chain resilience, and U.S.-China dynamics.


Time & Location
Nov 30, 2023, 3:00 PM
Hopkins Bloomberg Center, 555 Pennsylvania Avenue NW, Washington, DC 20001, USA
About the event
Summary:
The panel focused on the evolving nexus of challenges and opportunities in semiconductor technology, highlighting key aspects such as geopolitical needs and tensions, critical materials, design and integration, AI integration, and supply chain resilience. Dr. Andreas Andreou emphasized the crucial role of materials and their thermal properties for semiconductor manufacturing and packaging. Dr. Paulette Clancy emphasized the transformative role of AI in cutting down the parameter space to enable faster and more efficient material discovery.
The discussion also covered the geopolitical dimensions of semiconductor manufacturing. Dr. Ling Chen spoke about the state-business dynamics in the U.S. and China, emphasizing how government policies, such as the CHIPS Act and export controls, influence global supply chains and innovation. The question about the US expanding its domestic manufacturing capabilities and securing skilled labor is not whether it is possible, but rather how to provide the right incentives. China experiences…